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Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
Year : 1994Volume number : 17Issue:03
Fdtd Modeling Of Noise In Computer Packages(Article) Subject:
Fdtd
,
Computer Programs
Author:
Wiren D.
Becker
Pradit
Mittrapiyanuruk
page:
240
-
247
The Importance Of Material Selection For Flip Chip On Board Assemblies(Article) Subject:
Importance Index
Author:
Grace
O'Malley
Steve
Achuga
Jan
Giesler
page:
248
-
255
Flip Chip On Board Connection Technology Process Characterization And Reliability(Article) Subject:
Flip Chip
,
Connection Networks
Author:
Jan
Giesler
Grace
O'Malley
S.
Machuga
page:
256
-
263
Metal Capping Of Mcm Thin Film Features Using A Laser(Article) Subject:
Metal Composites
Author:
R.
Patel
T. A.
Wassick
C. Y.
Ralston
page:
264
-
268
Assessing Time-To Failure Due To Conductive Filament Formation In Multi-Layer Organic Laminates(Article) Subject:
Assessing Multiagent
Author:
Balu
Rudra
Michael
Pecht
David
Jennings
page:
269
-
276
Minimal Ic Pretest Requirements For Multichip Modules(Article) Subject:
Multichip Module
,
Mcm
Author:
Wolfgang
Daum
William E.
Burdick
page:
277
-
282
A Structured Testability Approach For Multi-Chip Modules Based On Bist And Boundary-Scan(Article) Subject:
Structured Dispersion
Author:
Yervant
Zorian
page:
283
-
290
Computer Vision For Auto,Atoc Onspection Of A High Density Grd Of Pads On Multi-Chip Moudules Mcm-D(Article) Subject:
Contaminant
Author:
Michael E.
Scaman
Laertis
Economikos
Julius
Lambright
page:
291
-
299
Foreword Contributions From The 1994 Ieee Conferencr On Wafer Scale Integration(Article) Subject:
Multi Component
Author:
Stuart
Tewksbury
Susumu
Horiguchi
page:
300
-
301
Fermi A New Generation Of Electronic Modules For Large Data Acquisition Arrays Required By High Energy Physics(Article) Subject:
Data
Author:
A. Dell
Acqua
C.
Alippi
N.
Yamadagni
page:
302
-
309
A Monolithic Processing Subsystem(Article) Subject:
Monolithic Catalyst
Author:
Joe E.
Brewer
Ira H.
Gilbert
James E.
Demaris
page:
310
-
317
The Wasp3 Monolithic Wsi Massively Parallel Processor(Article) Subject:
Author:
Ian. P.
Jalowiecki
page:
318
-
323
3d-Waspj Devices For On-Line Signal And Data Processing(Article) Subject:
3d Weaving
Author:
S. J.
Hedge
C. M.
Habiger
page:
324
-
333
Test Vehicle For A Wafer-Scale Thermal Pixel Scens Simulator(Article) Subject:
Wafer
,
Pixel Wise
Author:
G. H.
Chapman
L. S.
Carr
page:
334
-
341
Image Processing Using A Unicersal Nonlinear Cell And The Warp Wafer(Article) Subject:
Author:
V. K
Jain
L
Lin
page:
342
-
349
A Dynamic Clock Synchronization Technique For Large Systems(Article) Subject:
Dynamic Collapse
,
Large Systems
,
Synchronization
Author:
D. E.
Brueske
S. H. K.
Embabi
page:
350
-
361