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Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging

Year : 1994 Volume number : 17 Issue: 03

Fdtd Modeling Of Noise In Computer Packages (Article)
Subject: Fdtd , Computer Programs
Author: Wiren D. Becker      Pradit Mittrapiyanuruk     
page:      240 - 247
The Importance Of Material Selection For Flip Chip On Board Assemblies (Article)
Subject: Importance Index
Author: Grace O'Malley      Steve Achuga      Jan Giesler     
page:      248 - 255
Flip Chip On Board Connection Technology Process Characterization And Reliability (Article)
Subject: Flip Chip , Connection Networks
Author: Jan Giesler      Grace O'Malley      S. Machuga     
page:      256 - 263
Metal Capping Of Mcm Thin Film Features Using A Laser (Article)
Subject: Metal Composites
Author: R. Patel      T. A. Wassick      C. Y. Ralston     
page:      264 - 268
Assessing Time-To Failure Due To Conductive Filament Formation In Multi-Layer Organic Laminates (Article)
Subject: Assessing Multiagent
Author: Balu Rudra      Michael Pecht      David Jennings     
page:      269 - 276
Minimal Ic Pretest Requirements For Multichip Modules (Article)
Subject: Multichip Module , Mcm
Author: Wolfgang Daum      William E. Burdick     
page:      277 - 282
A Structured Testability Approach For Multi-Chip Modules Based On Bist And Boundary-Scan (Article)
Subject: Structured Dispersion
Author: Yervant Zorian     
page:      283 - 290
Computer Vision For Auto,Atoc Onspection Of A High Density Grd Of Pads On Multi-Chip Moudules Mcm-D (Article)
Subject: Contaminant
Author: Michael E. Scaman      Laertis Economikos      Julius Lambright     
page:      291 - 299
Foreword Contributions From The 1994 Ieee Conferencr On Wafer Scale Integration (Article)
Subject: Multi Component
Author: Stuart Tewksbury      Susumu Horiguchi     
page:      300 - 301
Fermi A New Generation Of Electronic Modules For Large Data Acquisition Arrays Required By High Energy Physics (Article)
Subject: Data
Author: A. Dell Acqua      C. Alippi      N. Yamadagni     
page:      302 - 309
A Monolithic Processing Subsystem (Article)
Subject: Monolithic Catalyst
Author: Joe E. Brewer      Ira H. Gilbert      James E. Demaris     
page:      310 - 317
The Wasp3 Monolithic Wsi Massively Parallel Processor (Article)
Subject:
Author: Ian. P. Jalowiecki     
page:      318 - 323
3d-Waspj Devices For On-Line Signal And Data Processing (Article)
Subject: 3d Weaving
Author: S. J. Hedge      C. M. Habiger     
page:      324 - 333
Test Vehicle For A Wafer-Scale Thermal Pixel Scens Simulator (Article)
Subject: Wafer , Pixel Wise
Author: G. H. Chapman      L. S. Carr     
page:      334 - 341
Image Processing Using A Unicersal Nonlinear Cell And The Warp Wafer (Article)
Subject:
Author: V. K Jain      L Lin     
page:      342 - 349
A Dynamic Clock Synchronization Technique For Large Systems (Article)
Subject: Dynamic Collapse , Large Systems , Synchronization
Author: D. E. Brueske      S. H. K. Embabi     
page:      350 - 361